Megapoxy 34

For underground cable jointing and the encapsulation of electrical components, Megapoxy 34 is a low-viscosity, 100% solids epoxy resin formulation designed for electrical insulation and casting. It conforms to AS3100-1990 (including amendments 1 and 2 by AGL) for the encapsulating and potting of electrical components and cable joints, protecting sensitive connections against moisture ingress and electrical failure.

High-insulation casting and potting

Megapoxy 34 pours easily into tight electrical switchgear housings, cable joints, and transformer casings due to its mixed viscosity of 905 cps. The low-viscosity liquid flows completely around intricate wiring, coils, and terminals to eliminate air voids that cause electrical tracking. Once cured, the formulation provides high dielectric strength (315 kv/cm) and volume resistivity ($10^{13}$ ohm.cm) to prevent short circuits in power transformers, lighting transformers, and instrument transformers. It also carries a high compressive strength of 90 MPa and resists chemicals and mechanical stress, protecting underground connections from soil pressure, shifting ground loads, and moisture.

Numbers that matter

• 30-minute pot life (at 25ºC): Practical working window to mix, pour, and thoroughly penetrate complex electrical coils and narrow cable joint casings before gelling begins.
• 6-hour setting time / 24-hour cure (at 25ºC): Reaches handling strength within 6 hours to allow joint movement, with a full cure at 24 hours to achieve maximum mechanical and electrical properties.
• 150ºC peak service temperature: Maintains insulation integrity and physical structure when exposed to the high operating heat of running transformers and heavy electrical loads.
• 4:3 mix ratio: Simple proportioning by either volume or weight (4 parts Part A to 3 parts Part B) for accurate preparation on-site or in workshop environments.

Where to use it

• Underground cable jointing and resin-filled potting shells.
• Encapsulation of instrument transformers and lighting transformers.
• Encapsulation of small power transformers, coils, and electronics.
• Casting electrical switchgear components.
• Mechanical and chemical resistant casting applications.

Limitations

• Do not prepare surfaces by wire brushing alone. Wire brushing is inadequate for this epoxy and will result in poor adhesion.
• Any surface impurities on the casting surfaces can reduce bond strength or inhibit the cure and bond to encapsulated items. Clean all surfaces with acetone or isopropyl alcohol before pouring.

Surface preparation and clean-up

To achieve reliable adhesion, clean all target surfaces with acetone or isopropyl alcohol to remove oil, moisture, and dust. For clean-up, use Megapoxy Thinners to clean mixing paddles and tools before the resin cures.